Basic Study On Integrated Electronic Molding Technology For Functional Integrated Interior Trim

With the development of intelligent and lightweight technologies,automotive interiors are increasingly demanding a sense of technology.The traditional in-mold composite process can make the product achieve the appearance effect of electroplating and painting process,and increase the degree of design freedom,but it can not form a product with specific functions,and can not meet the functional requirements of electrical,magnetic and optical transmission of products.Therefore,this thesis proposed an in-mold electronic integral molding process for functional integrated interior parts,which integrated electrical functions into flexible films by printing and surface mounting to prepare functionalized films,and then formed functional integrated interiors through in-mold composite process.The research was carried out along the route of “Product Design-Process Analysis-Deformation Optimization-Performance Verification”.Firstly,this thesis introduced the functional integrated components of traditional automotive interior.A multi-functional control panel of a vehicle was taken as the object of study.The panel control function was briefly described.The panel circuit,the head-lamp angle control scheme and the laying form of functional film were designed.Secondly,the finite element model of functional films was established to analyze the in-mold electronic integrated forming process.Four process parameters such as mold temperature,melt temperature,holding pressure and holding time were adjusted by orthogonal experiment and genetic algorithm to optimize the warpage deformation of the product.The error between the optimization results and the actual simulation results was only 1.22%,and the accuracy of the results was high.The interaction between electronic components and melt in the injection process was simulated and analyzed by the bidirectional fluid-solid coupling method.By adding cylindrical packaging,the deformation of the hollow part of the functional film keys was optimized,and the surface quality of the film was obviously improved.Then,the finite element model of flexible circuit board was established to simulate thermal property under different working conditions.Through the heat dissipation results of flexible circuit board,the thermal-structural coupling offunctional integrated interior decoration parts were verified.The results showed that flexible circuit board can work stably for a long time under different working conditions.The strain of product ends caused by temperature field was optimized with a fixed clasp.Finally,the functional integrated interior parts were formed by in-mould electronic process and verified by real vehicle installation.The results showed that the product can realize touch adjustment and control of various signals,and respond quickly.It worked for a long time under different working conditions,and the temperature was within normal range.It will not cause the problem of insensitivity or even failure of control due to excessive temperature.And the weight of functional integrated interior parts was only 61 grams.Compared with traditional mechanical switches,it achieved the goal of 78% weight reduction.In this thesis,the basic research on the in-mold electronic integrated forming process of functional integrated interior parts was carried out,and the process methods of optimizing warpage,injection and thermal deformation were explored.The research results have important application value.The research results of this thesis can provide a theoretical basis and practical guidance for the improvement of the forming process of functional integrated components.