Thermal Simulation Analysis For The High-power Integrated Electronics And Study Of The Cooling System

In recent years, the electronics have been applied in almost every field anddevelop to be tiny and integrated with the development of technology, whichincreases the difficulty of assembly but also make the thermal control hard.According to statistics, most of the electronics damaged because the workingtemperature has exceeded its normal temperature. Therefore, heat dissipation of theelectronics is crucial for its normal working. There are different kinds means ofthermal control in which liquid forced cooling has been a hit because of its efficientcapacity as a kind of thermal control.Taking a electronic as research objects, this paper has designed a coolingsystem which based on the core equipment of cooling plate by analyzing the therm alfeature of the electronic. In the first section, we create a physical model for theelectronic and make thermal simulation which includes the states in transient andsteady conditions. We can obtain the relation between the thickness of cooling plateand the time that the working electronic temperature gets to125℃. We find the timeto125℃of the working electronic will be extended with the increase thickness ofthe cooling plate. In addition, we find that the maximal temperature of the chipsinside electronic can be limited less than125℃when the temperature of theelectronic sidewall temperature is less than70℃, which can insure the electronic ina normal working temperature.Secondly, we design a cooling plate for the electronic based on its thermalshow. Taking consideration of the structure of the electronic and the location of theholes on it, we design some kinds of flow channels and diferent coners, then wechoose the cooling plate with the best thermal performance by contrast. Then weuse the chosen cooling plate to analyse the flow and thermal behaiver of the fluid inthe cooling plate and we can summerize it in three parts: Studying the affection ofthe scale of the channnel to the flow and therma behaivor of the fluid; The quantityof the energy loss in the processes of flow; Proposing two schemes of cooling plateand get the best one by contrast at last.Finally, this paper design a cooling system for experiment based on the coolingplate which is designed in last section. First, we purchase the relevent eqipmentsand design a PLC procedure for data measurement and system adjustment. Then weget the datas about pressure drop and temperture by a simplifyied experiments. Atlast, we certify the correctness of the simulation in before by comparing the datas between experiment and simulation by software. At last, we get the flow resistenceof the whole cooling system to supply a reference for the engineering application.