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Research On Load Inductance Of Press-pack IGBT Dynamic Test Platform

Posted on:2021-04-12Degree:MasterType:Thesis
Country:ChinaCandidate:W C ZhaoFull Text:PDF
GTID:2392330614471500Subject:Electrical engineering
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Nowadays,flexible DC transmission technology has became the most popular technology in the market as it's unique hermetic packaging and crimping structure,the Press-Pack IGBT completely eliminates the problems of bond wire shedding and solder layer fatigue,replacing soldering IGBT as the main converter device in the market.Usually the Press-Pack IGBT needs to test its dynamic characteristics before application,so its dynamic test platform needs to be regularly optimized,and the load inductance is an indispensable part of the platform,which requires in-depth research.The current academic documents lack discretely discussion and research on load inductance parasitic capacitance effects.Therefore,accurate analysis of the influence of load inductance parasitic capacitance on the dynamic characteristics of Press-Pack IGBT will help to improve the reliability of the test platform such as the problems of large size,complex internal structure,and poor flexibility severely restrict the compactness and flexibility of the platform structure.In this cast,reducing the load inductor volume and using highly coupled stacked spiral inductors are of great significance for optimizing the test platform.Firstly,this thesis describes the standards and principles of the dynamic test of the Press-Pack IGBT,which lays the theoretical foundation for subsequent research;the transient test process of the dynamic test circuit after considering the load inductance parasitic capacitance is analyzed,and the larger the load inductance parasitic capacitance the peak value of the collector current overshoot is greater at the moment when the Press-Pack IGBT turns on,and the correctness of this conclusion is verified by Saber simulation and experiments of winding hollow inductors of different sizes of parasitic capacitance.Secondly,in order to introduce the laminated spiral inductor in the platform,firstly,the requirements of the platform for load inductance in terms of inductance value,frequency spectrum and insulation strength are analyzed for the 4.5k V / 1.6k A Press-pack IGBT of Westcode.Then,the equivalent model and parameter definition are given to combine Parasitic capacitance requirements and miniaturization goals,to optimize the design method of laminated spiral inductors,to determine the structural parameters of laminated spiral inductors,to build a 3D model through Solidworks software,and to import ANSYS software for simulation.The analysis of the simulation results,heat generation and electromagnetic force proves the accuracy of the theoretical design of the laminated spiral.Finally,the production of the laminated spiral inductor have been completed and the impedance test have carried out.The measured inductance value and the parasitic capacitance value obtained in the test were consistent with the theoretical and simulation results.Moreover,the impedance test of the current load inductor(dry air core reactor)was tested.After comparing the two inductors,it is found that the laminated spiral inductor has obvious advantages in parasitic capacitance and volume.In order to ensure safety,an insulation withstand voltage test was carried out before the application of the laminated spiral inductor.When the test voltage was 8k V(> 6.75 k V),the partial discharge phenomenon did not occur,so the laminated spiral the insulation of the inductor met the design requirements and could be applied.The laminated spiral inductor was connected to the dynamic test platform,the obtained collector-emitter voltage and collector current waveform was matched test standard.In addition,the collector current was measured by the current load inductor and compared two waveform results between both inductor.The waveform comparison shows the superiority of the laminated spiral inductor.
Keywords/Search Tags:Press-Pack IGBT, dynamic test platform, load inductance, parasitic capacitance, stacked spiral inductance
PDF Full Text Request
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