Reliability Analysis Of Domestic SOD Plastic Packaging Devices

In recent years,Chinese military aerospace technology has been developed rapidly and already in the world's leading level.Now it is developing for smaller and lighter.Compared with traditional ceramic and metal packaging devices,plastic packaging devices with low cost,small size,light quality.and other characteristics are gradually taking up more and more higher proportion in the aerospace industry.Due to the working environment of the device in the aerospace is relatively harsh,the reliability of the device are relatively higher.In GJB 7400-2011 the national military device standard,the military aerospace device is required to meet the N-level test screening.However,Chinese research on high-reliability plastic packaging devices started late and has been restricted by foreign.Therefore,China's plastic packaging devices used in high-reliability fields such as military aerospace are mainly imported from Europe and the United States.But military aerospace devices relying on imports will not only waste a lot of manpower and material resources due to the need to re-screen,but also pose a hidden danger to national security.Therefore,it is very important to develop and produce China's own high-reliability plastic packaging devices.In this paper,we use finite element software to analyze stress and strain of the SOD-323 devices produced by a domestic company with different kind of molding compound,like EK5600GHR,EK5600GH,EK5600H and GR-700 and GR-710 under the test deformation of GJB 7400-2011,SJ/T 10745-96,GB/T 4937.4-2012 and JEDEC.This paper includes the following:1.Design experiments to measure saturated humidity C_sat of five types of molding compound,like EK5600GHR,EK5600GH,EK5600H and GR-700 and GR-710,at the temperature of85? and 130?.Then take the measurement results into the Arrhenius formula for the relationship between the saturation humidity C_sat and the temperature T of the different types of molding compound.Finally,the above five types of molding compound are obtained.The saturated humidity C_sat under the high temperature-pressure test conditions of 121?,HAST test conditions of 110? and 130?,and MSL test conditions of 85? were provided for the following simulation tests.2.Using finite element software to simulate the deformation,stress and strain of SOD-323devices with five types of molding materials such as EK5600GHR and so on,under the high temperature-pressure test load of GJB 7400-2011 and SJ/T 10745-96.Comprehensive analysis of the above deformation,stress and strain simulation results,the maximum deformation of the devices with GR-700 and EK5600GHR molding materials under the GJB7400-2011 standard are 5.599?m and 5.726?m,the maximum stresses are 459.767MPa and450.574MPa,the ratios of 9.299×10^-3 and 8.777×10^-3,which are relatively smaller,compared with the other three types of molding materials.Therefore GR-700 and EK5600GHR can be regarded as the best choice.Compared with the high temperature-pressure test of SJ/T 10745-96 standard,the maximum deformation increases by 13.89%and12.64%,the maximum stress increased by 2.94%and 4.09%,and the maximum strain decreased by 45.91%and 44.22%.3.The finite element software is used to simulate the deformation,stress and strain of SOD-323 devices with five types of molding materials under the HAST test conditions of130?/85%RH and 110?/85%RH.Based on the above simulation results,the maximum deformation,stress and strain of GR-700 under the HAST test conditions of 130?/85%RH is 8.248?m,495.013MPa and 18.11×10^-3.Compared with the devices with the other four types of molding compound,the ratio is in a smallest position and can be regarded as a choice.At the same time,compared with the test conditions of 110?/85%RH,the maximum deformation increased by 99.76%,the maximum stress increased by 24.24%,and the maximum strain increased by 21.84%.4.Simulates the deformation,stress and strain of the device with the MSL1 and MSL2moisture absorption test in the reflow soldering simulation process.Comprehensive analysis of the above simulation results in the reflow process,the maximum deformation,stress and strain of the device with the model of GR-700 absorbing moisture with MSL1 test are25.852?m,225.4.32MPa and 70.256×10^-3.Devices with other types of molding compounds can be considered as a choice.Compared with the MSL2 moisture absorption test,the maximum deformation of the device increased by 45.09%,the maximum stress increased by92.92%,and the maximum strain increased by 43.54%.