The Optimization Of Microchannel Heat Dissipation Structure And Its Application In T/R Components

With the development of the electronic chip integration,the heat generated when the integrated chips work also rises sharply,the heat dissipation problem for the heat source with high heat flux becomes the primary problem to ensure the reliably and continuously work of the chips.Micro-channel heat dissipation is the most potential way to solve the heat dissipation problem for the heat source with high heat flux.The research on microchannel radiator has always been an important topic in the field of heat dissipation.In this paper,the micro-channel radiator is optimized from the thermal simulation boundary conditions and channel structure,and a cross-flow channel is proposed and optimized,and a software is developed to store and check the thermal simulation data of the crossflow channel.Finally,the optimized cross-flow channel is applied to the heat dissipation problems of typical high heat flux heat source arrays and surfaces.The specific research contents are as follows:(1)Research on boundary conditions of conventional rectangular micro-channel thermal simulation and its channel structure optimization.In the optimization of boundary conditions,optimization is carried out from three aspects: thermophysical property,fluids and cold plate materials.In the aspect of structure optimization,the heat exchange area is optimized,which includes the channel plate spacing and the number of channels.Finally,the optimal channel plate spacing and the number of channels are obtained.(2)Research on cross-flow channel and its structure optimization.Considering the requirement of thermal homogeneity in the heat dissipation problem of highly integrated chip surfaces,a cross-flow channel is proposed.The thermal simulation results of the conventional one-way flow channel and the cross-flow channel under the same boundary conditions are compared to verify the heat dissipation effect of the latter.The cross-flow channel is further optimized from the cross-sectional area of the inlet and outlet and the slope of the flow channel,and finally three optimized cross-flow channel are obtained.The size parameters and thermal simulation results of those three optimized cross-flow channel and original cross-flow channel were sorted and summarized,and a software was designed and developed to store and query the thermal simulation data related to the cross-flow channel.(3)The application of the cross-flow channel in the T/R components.Considering the T/R component as a typical high heat flux heat source for a wide range of applications,the cross-flow channel and its optimized structures are applied to the T/R component array and the T/R component surface,respectively.In the heat dissipation problem of the T/R component surface,the thermal simulation research is carried out from the ideal model and the actual model respectively.The influence of the distribution pattern and quantity of the mainstream channels in the actual model on the heat dissipation effect of the model are discussed.Four cross-flow channels with different mainstreams setting modes are designed,their thermal simulation results show that the heat dissipation effect of the double-inlet-four-outlet cross-flow channel is the best.Finally,the optimized crossflow channels are modeled and simulated according to the double-inlet-four-outlet mainstreams setting mode.The comparison of the thermal simulation results shows that the double-inlet-four-outlet 1.5mm-0.5mm slope cross-sectional area cross-flow channel has the best heat dissipation result.