Study On Bonding Application And Thermal Aging Characteristics Of Hightemperature Resistance Epoxy/DDS Resin Systems

Epoxy resins constitute a very important class of polymeric materials,but conventional epoxy resin has insufficient thermal resistance.In recent years,with rapid developments in the microelectronics industry and increasing environmental awareness,the miniaturization of electronic devices and the application of lead-free solders in the electronics field have become inevitable.Hence,higher requirements have been placed on the heat resistance of epoxy resins.In response to this situation,we have studied and compared the bonding and thermal aging properties of several high-temperature resistant epoxy resins with different structures.In the present study,performance of several high temperature epoxy resin systems,prepared using 4,4-diaminodiphenylsulfone(DDS)as the curing agent by the same curing process,was investigated.And the possibility of its application to copper clad laminates was explored.The curing behavior was studied by dynamic rheometry and differential scanning calorimetry(DSC).The thermal properties of the cured resins were investigated by dynamic thermomechanical analysis(DMA),thermomechanical analysis(TMA),and thermogravimetric analysis(TGA).The peeling properties,mechanical behaviors,and moisture absorptivities of the cured resins were also studied.In addition,these resin systems were thermal aged at 180 ~oC,200 ~oC and 215~oC.The mechanical properties and thermal properties after aging were analyzed.Combination of thermogravimetric-infrared(TGA-FTIR)tests,we have obtained the thermal aging characteristics of several resin systems.The results showed that traditional diglycidyl ether of bisphenol A epoxy(DGEBA)has better mechanical properties and to be insufficient in heat resistance.Cannot be used for a long time at higher temperatures Naphthalene-based epoxy resin(EPBN)and bifunctional cardo epoxy resin(BFCE)showed better heat resistance.However,the processability and adhesive properties may not comply with the application requirements.Biphenyl novolac epoxy resin(BPNE)has balanced performance in all aspects.It can work stably at high temperature for a long time,suitable for high temperature adhesives.