Study On Preparation And Properties Of High Temperature Resistant Epoxy Resin-Based Electronic Packaging Material

In the field of consumer electronics and industrial electronics,the importance of packaging equipment is self-evident,and packaging materials are an important guarantee for the stable and safe operation of equipment.Epoxy resin is widely used as electronic packaging material because of its good corrosion resistance,low price and easy processing and molding.However,the existing epoxy potting compound can not meet the service environment of high temperature and high pressure,so it is urgent to develop potting compound with high heat resistance and excellent electrical properties.In this thesis,four-functional epoxy resin AG70 and phenolic epoxy resin F51were blended in different proportions,and then epoxy resin samples with different blending ratios were prepared by hot pressing process.The microstructure,phase structure,heat resistance and insulation properties of epoxy resin samples were systematically characterized and analyzed,and the influence of temperature field on the properties of epoxy resin-based packaging materials was tested.The results show that with the increase of the proportion of F51,the insulation properties of epoxy resin samples are improved,but at the same time the thermal properties are decreased.When the blending ratio of AG70 and F51 is 5:5,the comprehensive properties of（EP55）copolymer are the best,and its glass transition temperature is 213.3°C,which is about twice that of common E51 epoxy resin,so it has good heat resistance.At room temperature,the electrical conductivity of EP55 is 2.92931×10^-15S/m,and the charge dissipation ability is good,showing good insulation.On the basis of the above work,bismaleimide（BMI）was selected as filler,and BMI/EP55 copolymer was prepared by hot pressing.The properties of epoxy resin samples were systematically characterized and analyzed.The results showed that the thermal properties of epoxy resin samples were obviously improved with the increase of BMI doping ratio,but the insulation properties of epoxy resin samples decreased when BMI doping exceeded a certain amount.When the doping amount of BMI is 10%（10%BMI/EP55）,the comprehensive properties of the copolymer are the best.The initial decomposition temperature can reach 415.6°C and the activation energy is 0.79240 e V,which shows excellent thermal properties.At room temperature,the DC breakdown strength of 10%BMI/EP55 is as high as 215.4k V/mm,and it has a deep electron trap.Through research,this thesis puts forward an effective method to improve the comprehensive properties of epoxy resin packaging materials,and obtains epoxy resin-based packaging materials with excellent electrical and thermal properties,which has great application potential in the field of electronic packaging.