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Manipulation Of Surface Wettability On Copper Films

Posted on:2013-11-05Degree:MasterType:Thesis
Country:ChinaCandidate:Y LiuFull Text:PDF
GTID:2381330488984320Subject:Organic Chemistry
Abstract/Summary:PDF Full Text Request
Wettability of solid surfaces is an important property,Controllable surface wettability of solid substrates has aroused great interest in all areas for their importance in fundamental research and industrial applications in recent years.The wettability of solid surfaces is governed by the chemical composition as well as the geometric structures of the surfaces,and it is normally characterized using contact angle(CA)measurements.A surface with water contact angle(CA)larger than 90° is usually called a hydrophobic(oleophobic)surface and that higher than 150° is called a superhydrophobic(superoleophobic)surface.On the other hand,when a water contact angle(CA)smaller than 90° is called a hydrophilic(oleophilic)surface and that smaller than 5° is called a superhydrophilic(superoleophilic)surface.In this dissertation,we report on two simple echniques which are electroless plating and electroplating respectively for fabricating micro-and nanostructured copper films and manipulating surface wettability on copper films.First of all,creating micro-and nanostructured copper nanoparticles films on the surfaces of acrylic fabric by the method of electroless plating.We get superhydrophobic films when the micro-and nanostructured copper films are chemically modified with material of dodecanethiol which is low surface free energy.Firstly we all so study the influence of the temperature in electroless plating solution to the property on coated copper lays and the concentration of dodecanethiol in absolute alcohol to the wettability on the surface of copper films.This methed has a good guide to the application of preparing superhydrophobic fabricin in stain resistance and rad resistance.Secondly,we have created micro-and nanostructured copper nanoparticles films on the surfaces of stainless steel mesh by the electrochemical deposition(ECD)approach.The effects of the temperature of coating solution to the property of coating copper and the variation of wettability of copper films on the surface of stainless steel mesh as the chemical composition and chemical structure of different thiols were studied.It was found out that water contact angle on the modified copper films as a function of chain length of thiols is increasing,and provide a new means to manipulate surface wettability between superhydrophilicity and superhydrophobicity.Compared with the sduties in the past which's main purpose was to prepare a superhydrophobic surface simply,but to manipulate surface wettability of mesh fimls is particularly important to realize the separation of a complex liquid.
Keywords/Search Tags:wettability, copper, superhydrophobic, contact angle, liquid separating
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