Molecular Dynamics Simulation Of Interfacial Thermal Resistance Of Graphene Thin Films And Heat Transport

With the development of manufacturing technology,electronic devices have been increasing integrated,and their characteristic lengths are on the nanoscale.The behavior and reliability of nanodevices are strongly dependent on the system's cooling method.Therefore,the cooling effect of the equipment is one of the key factors of its good working performance.Graphene has some applications in the field of electronic devices.When graphene is filled into the surface or interior of an electronic device,the thermal resistance of the graphene affects the thermal transport process.In addition,the bottom layer of the microfluidic system will have heat transfer at the solid-liquid interface.In this paper,molecular dynamics methods are used to study the interface heat transfer between graphene films and several typical solids and liquids.For the interface heat transfer between graphene and semiconductor,the interface between graphene and silicon and gallium nitride is studied.With the increase of temperature,the interface thermal conductivity of the semiconductor and the graphene film increases,and the thermal conductivity of the gallium nitride substrate and the graphene trends to be larger than the interface thermal conductivity between the silicon substrate and the graphene.With the graphene layer increasing or there are some gaps on the interface material,the interface thermal conductivity between graphene and the semiconductor is reduced.For the interface heat transfer between graphene and metal,this paper explores the interface between graphene and copper.We found that as the temperature increases,the interface thermal conductivity of copper and graphene increases.When there is a gap in graphene,the thermal conductivity of the interface first increases rapidly,and as the gap area further increases,the interface thermal conductivity decreases.As the axial length of the metal increases,the interface thermal conductivity between the metal substrate and the graphene film increases.The influence of the thickness of the liquid film,the density of the liquid and the action intensity of the surface of the liquid water and graphene on the thermal conductance of the interface were investigated by molecular dynamics method.As the thickness of the water filmincreases,the thermal conductivity at the interface between the graphene and the water film decreases and tends to be stable afterwards.As the density of water increases,the intensity of action between water and graphene increases,the thermal conductivity at the interface between water and graphene increases.