Study On Integrated Forming And Curing Of Heterogeneous Functional Parts Based On Droplet Injection

Achieving simultaneous fabrication of the structural portion and the electromagnetic portion is one of the main steps to manufacture Conformal Load Bearing Antenna Structure(CLAS),based on integrated forming fabrication of microdroplet ejection.and the key to realize synchronous manufacturing is to enable integrated forming and curing between heterogeneous materials.In view of the differences in curing methods and process parameters of different materials and the compatibility of materials with processes,this thesis focuses on the UV curing and laser sintering curing processes,and optimizes the main process parameters to form a conformal antenna.The integrated forming manufacturing lays the foundation for the process.Firstly,the forming mechanism of the photocurable resin and the main factors affecting the photocuring formation were investigated.The reaction mechanism of UV curing and the influence of parameters such as irradiation intensity and temperature on the photocuring process were analyzed.A simulation model of the influence of irradiation intensity on the temperature field of photocurable resin was established.The influence mechanism of different irradiation intensity on the temperature field of photocurable resin was analyzed.At the same time,aiming at the problem of large temperature field change during the curing process,through the analysis of simulation results and the experimental study of curing interval time,the scheme of reducing the temperature field is proposed,and the simulation model is verified by experiments.Secondly,the influence of the temperature field of laser sintering curing on the conductive ink and the resin substrate was analyzed.The process of laser sintering conductive pattern and resin substrate was simulated and simulated.The research focused on the sintering of conductive ink and resin substrate with different laser beam size and scanning pitch under the condition of constant power and speed.The sintering simulation of conductive ink and resin substrate shows the variation of temperature field under different process parameters.Thirdly,the prototype of heterogeneous functional parts integrated forming principle was developed,and the composite curing function of ultraviolet curing and laser sintering was realized,and the components including the mechanical and structural parts of the prototype machine,the control system and the software of the upper computer were carried out.Developed and designed to achieve a maximum operating speed of 120 mm/s,the device X/Y/Z axis repeat positioning accuracy of 0.020 mm/0.020 mm/0.010 mm,respectively,A/C axis repeat positioning accuracy of 0.005°/0.005°.The main parameter indicators such as the small line segment forward-looking control,uniform speed printing/curing control and other functions have been realized to finally realize the manufacture of heterogeneous functional parts integrated forming,providing an experimental platform.Finally,an experimental scheme for the integrated forming of heterogeneous functional parts was designed.The simulated heterogeneous functional parts were used to simulate and compare the experimental parameters of UV curing and laser sintering.The experiment optimized the curing process parameters of the heterogeneous functional parts.The results show that the flatness error of the surface of the printed resin substrate reaches 0.046 mm,and the conductivity of the conductive pattern is the largest 1.11?10~7 S/m.And using the optimized process parameters,the integrated fabrication of the 5 GHz microstrip antenna was realized and its performance was verified.In this thesis,the research on the process of UV curing and laser sintering curing contributes to the process optimization research of the forming direction of heterogeneous materials,and lays a foundation for the integrated forming of electronic equipment such as conformal antenna.