Heat Dissipation Design And Numerical Simulation Of Water Cooling Cold Plate For 256 Channels Ultrasonic Phased Array Instrument

The water cooling cold plate electronic heat dissipation technology has the adventages of good heat dissipation,moderate cost,noise and vibration free,and so on.This paper is titled as“heat dissipation design and numerical simulation of water cooling cold plate for 256 channels ultrasonic phased array instrument”.The main purpose of this paper is making thermal design for the 256 channel ultrasonic phased array instrument by developing a water cooling cold plate cooling system.This paper focus on the thermal design,numerical simulation,and experiment verification of the pin fin S type channel cold plates and the prismoid microchannel heat sink with wedged channels to improve the reliability and stability of instrument,and,provide practical reference for the development of cooling technology of electronic equipment.The work has been supported by the national major scientific instrument and equipment development special"new type ultrasonic phased array instrument development and application"(NO.2013YQ230575).After reviewing research progress of the"instrument cooling technology"and"cold plate technology",we pointed out that:(1)There are few researches about the the pin fin S type channel cold plates;(2)There are few researches about using cold plates cooling system in the actual commercial electronic instrument;(3)There are few researches about microchannel cold plate structure innovation.So we proposed the pin fin S channel cold plate and the prismoid microchannel heat sink with wedged channels.The main works of this paper are as follows:(1)Designed and developed the pin fin S channel cold plate cooling system for the 256 channel ultrasonic phased array instrument;established the basic mathematical calculation and physical model of fluid solid heat coupling numerical simulation;given the cold plate performance evaluation model.(2)Compared the performance of the S channel cold plate and the pin fin S channel cold plate by numerical simulation under the same boundary conditions to explore the performance characteristics of the S channel cold plate.The results show that,compared with the S channel cold plate:(1)the pin fin S channel cold plate has better performance that its adventages will be enhanced with a smaller water flow rate and a larged heat flux;(2)when the heat flow density is 80W/cm~2 and the water flow rate is 5m/s,the maximum average surface temperature reduction,the maximum maximum surface temperature reduction,the maximum average surface temperature reduction ratio,and the maximum maximum surface temperature reduction ratio can up to 21.778 C,25.063 C,21.5551%,and 22.9138%respectively;(3)the S type channel cold plate can disturb the streamline of vortex that the flow vector of vortex is blocked by the pin fin.So the pin fin can accelerate the full development of corner flow.(3)The thermal and hydraulic performance of a prismoid-shaped microchannel heat sink with wedged channels were investigated.With a same pumping power consumption and a silicon substrate,the prismoid design has a maximum overall thermal resistance decrease 29.0%,24.2%,and 13.4%compared with that of the single-layered,double-layered,and the width-tapered designs at pumping power 0.6W,1.5W,and 0.3W respectively,however,for a copper substrate,the improvements are 36.9%,17.4%,and 25.2%at the same conditions,respectively.The proposed wedged channel structure can maintain the heat source(with a heat flux 100W/cm~2)surface temperature within 32.1?~36.2?which means it can be used for the heat dissipation of the 256channel ultrasonic phased array instrument.(4)Verification test of the pin fin S channel cold plate cooling system has been achieved.The results show that the maximum relative error between the experiment data and the simulation data is less than 5%which means the numerical calculation model is effective.The pin fin S channel cold plate cooling system can maintain the heat source(with a heat flux 36W/cm~2)surface temperature less than 60?which means it can meet the cooling requirement of the instrument.The pin fin S channel cold plate cooling system has been applied to commercial256 channel ultrasonic phased array instrument,which can effectively meet its heat dissipation requirements.