Research On Millimeterwave Key Passive Device Of Modeling And Simulation Based On LTCC

In the 1980 s,Surface mounting technology(SMT)with high density package occurred until now.Ten years later,multichip module(MCM)technology had come into being.It means the different performance semiconductor chip are packaged on the multilayer substrate and connection with via between layers.It is a electronic system and product technology with high reliability for the whole mudule package.According to technology and substrate,MCM was classified for MCM-L,MCM-C and MCM-D.MCM-L is multilayer printing substrate mudule with common glass epoxy and it possess low cost,mature technical,high flexibility,but the low wiring density.MCM-C is multilayer wiring with thick film technology and module with ceramic(aluminium oxide or glass ceramic),it is the same as thick film hybrid IC with multilayer ceramic substrate and higher than MCM-L in wiring density.HTCC and LTCC are distinguished according to sintering temperature.Multilayer wiring is made of thin film technology in MCM-D which makes use of ceramic(aluminium oxide or aluminium nitride),Si or Al as substrate and it has high wiring density and cost.LTCC(Low Temperature Co-fired Ceramic)has been the key way of SIP(System In Package)because of technical characteristic and advantage,hence it has been prevalent in high density package technology at present.LTCC was exploited by Hughes in 1982.Some developed countries have got huge improvement at industry technicalization and large numbers of successful corporations in technology have also appeared,like Dupont,NS,KYOCERA and so on.Though the birth of LTCC is quite late in China,there are many corporations have possessed mature technology nowadays.However,it still relatively falls behind in research and development about LTCC designing platform and modeling,therefore it restrict designing and development of LTCC product.Major work is modeling based on LTCC designing platform in the paper.Modeling is about basic transmission line,transition structure,coupling structure and common microwave passive device in millimeter wave frequency.In addition,it still relates some designing in miniaturization.As follow:1.LTCC basic transmission line modeling.This paper states the structure and formula of basic transmission line,furthermore comparative designing and simulation will be given according to microstrip,stripline and coplanar waveguide with different length in Ka band and W band.Finally performed microwave characteristic will be analyzed in different condition.2.LTCC modeling of transition structure and coupling structure.This paper states the designing of layer-to-layer microstrip to stripline and stripline to stripline transition structure in Ka band,comparative analysis and simulation of transition structure will be given in different angles,then compare with the difference of microwave characteristic between different angles and analyze the reason according to the difference.In addition,coupling structure designing will be given in Ka band and circuit function will be realized by use of coupling structure.3.LTCC microwave passive device designing.Several bandpass filters will be realized by use of former designing basic transmission,transition structure and coupling structure modeling combined with layer-to-layer interconnected via characteristic,including coupling line structure filter and SIW(Substrate Integrated Waveguide)filter,then make filters miniaturization by use of LTCC multilayer circuit substrate advantage and get well result.4.Layout processing and measurement.Compared with the result between tape-out measurement and simulation modeling,then verify the feasibility and validity of passive device structure and analyze the caused reason and difference.Finally provide the analysis according to measurement and put forward improvement method.5.LTCC designing platform modeling.Models which have passed tape-out and measurement and have reached product target are embedded in LTCC designing platform,it will be more convenient and possible to LTCC circuit design,then lay a solid foundation for LTCC circuit designing in the future.