Study On Thermal Optimization Of 3D IC On TSV Cluster Structure

With the development of society and technology,the demand for the integration of integrated circuits and the working speed are increasing gradually.The three-dimensional integrated circuits not only meet the needs of integration but support the heterogeneous integration.So,its quality is of great significance to national development strategy.At present,to alleviate the thermal problem of three-dimensional integrated circuits,this paper studiesthe thermal characteristic of TSV clusterand put forward a novel TSV cluster structure.This paper proposes TSV clusters' modeling method andthermal evaluation method.To verify these methods,we do lots of simulation and apply them in real circuits.The three-dimensional integrated circuit(Three Dimensional Integrated Circuits-3D IC)technology is based on the traditional two-dimensional circuit.Through the chip thinning,the combination technology,the two-dimensional circuits are stacked in the vertical direction.TSVs,as interconnections in the vertical direction of three-dimensional chip,not only can play the role of signal transmission,but also effectively promote the heat conduction in the vertical direction.In this thesis,we study the TSV cluster structure in 3D Integrated circuits.The main work is as follows:The three-dimensional model of TSV is established and the thermal simulation method based on finite element simulation is verified.Based on the finite element simulation software COMSOL,this paper establishes a three-dimensional integrated circuit TSV cluster model.The basic parameters and thermal models of TSV are studied.Through the analysis of the parameters of TSV,the corresponding TSV simulation results verified the correctness of the simulation method because our results are familiar with others'.In this paper,a novel TSV cluster structure is proposed for the first time by exploring the thermal characteristics of the TSV cluster.Based on the thermal analysis of the TSV bundles of various layout models,the results are compared and analyzed,and the optimal thermal characteristics of the TSV cluster under the condition of TSV layout are investigated.Based on the conclusion,an innovative TSV bundle structure is proposed.In this paper,the thermal characteristics of the new structure of TSV cluster are comprehensively investigated.Analyze the utilization rate of the TSV cluster,the thermal properties of four kinds of basic unit,lateral heat conduction characteristics and vertical thermal characteristicsof innovation cluster structure of TSV,and the overall structure of TSV innovation cluster characteristic.Evaluation algorithmand the TSV cluster innovation structure arrangement algorithm are proposed in this paper.Based on the design of TSV cluster algorithm,the innovative TSV cluster structure is proposed.This paper put forward the corresponding arrangement algorithm to evaluate the thermal characteristics of cluster.According to the heat source in various shapes and according to the arrangement of the designed algorithm,this paper establishes the corresponding 3D model.Based on this model,the validity of the proposed method is verified in line with the simulation results.Last,based on the IBM benchmark circuits,this paper appliesthe proposed method in actual circuit TSV.In this paper,the innovative TSV cluster structure can effectively reduce the heat dissipation problem of 3D Integrated circuits.The arrangement of evaluation algorithm can be part of a three-dimensional integrated circuit EDA tools.Also,it can optimize three-dimensional integrated circuit designing process.