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Research On 3D Electronic Circuit Forming Technology Based On Laser Induced

Posted on:2019-04-29Degree:MasterType:Thesis
Country:ChinaCandidate:J X DaiFull Text:PDF
GTID:2348330548950480Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The traditional electronic circuit molding process is complicated and long.The rapid development of miniaturization of electronic instruments requires simplifying the electronic circuit molding process,and the line width and spacing need to be continuously refined.The laser-assisted electroless plating technology can realize rapid molding of fine electronic circuits without pollution and has a good application prospect in the microelectronics industry.In this paper,the widely used ABS plastic is used as the experimental substrate,and the electronic circuit is formed on the surface by laser-induced electroless plating.However,plastics do not have catalytic activity and need to be activated before electroless plating.The traditional activation method is costly and the precious metal contamination is serious.In this paper,a novel laser-free activation technique for plastic is proposed.A mixed solution of Cu SO4?Ni SO4?and Na H2PO2 is used as the activating solution.A transparent activation layer is coated on the surface of the substrate,and a 450nm blue laser is used to scan activation layer and the layer reacts under the laser thermal effect to generate active Cu?Ni?particles.Orthogonal experiments were carried out to optimize the activation ratio,spot diameter,scan rate,number of coating parameters and the electroless copper plating recipe.XRD,SEM and other analytical methods were used to verify the activation reaction principle.Using the optimal process to form the circuit coating on the ABS plastic surface,the outline of the coating is clear,the corners are neat,and the resistivity is 3.37×10-8?·m,which is twice the standard resistivity of copper.Thermal cycle experiments show that the coating has good bonding.A 15?m Ni-P-Cu alloy coating was deposited on the surface of the ABS plastic substrate and the circuit coating layer.The electromagnetic shielding performance was close to 80d B,which was in line with the military requirements.The scratch test showed that the gradient coating had a good bonding force.
Keywords/Search Tags:ABS plastic, Laser no palladium activation, Electroless copper plating, Electronic circuit, Electromagnetic shielding
PDF Full Text Request
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