IGBT Junction Temperature Measurement Research And Application Via Combined D-TSEP

High power IGBT module is widely used in the aspects of HVDC,high speed electrical traction and so on.The reliability of it has significant influence on the operating safety of the whole system.The purpose of operating condition simulation test platform is to research the switch transient,junction temperature extraction and life prediction of high power IGBT module by simulating the real operating condition.This paper illustrates the design of the software to satisfy the requirement of test platform,and proposes a new junction temperature measurement method by combined D-TSEP.In the design of upper computer software,this paper applies the modular programming principle into the project,devides the function of sofeware into several sub-states,completes the tasks of remote control and data display by shifting among different sub-states.The software has advantages on the convenience of debug and avoids repeated operation.In the aspect of junction temperature extraction of high power IGBT module,this paper analyzes the switch transient at first.Different TSEPs(Thermal Sensitive Electric Parameter)are compared and analyzed using the packaging characteristics and the parasitic inductance,in which the linearity of TSEPs is carefully discussed.Based on the analysis,a combined D-TSEP junction temperature measurement method is proposed,focusing on the disadvantage of individual TSEP method that the results is influenced by operating current.The principle of combined TSEP method is illustrated in the paper and verified by experiment.In addition,the proposed method is compared with individual TSEP method in the following five parts:accuracy,application,measuring complexity,calibration complexity and current measure requirement.Based on the linear-combination of TSEP,the higher order optimization method is proposed to expand its application on modules without good linearity TSEP.Simulation Experiments have been implied to verify the applicability of proposed method.The content is summerized and the prospect of operating condition simulation test platform and combined D-TSEP is presented at the last part of the paper.