High Temperature Deformation And Sintering Phenomenon Of Silicon Microchannel Array

Silicon materials are used as new microchannel plate matrix materials due to their good thermoelectric properties,stable chemical properties and relatively mature micromachining techniques.Compared with the traditional microchannel plate,the silicon microchannel plate has incomparable advantages in both the gain performance of the device and the service life.In this paper,silicon microchannel plate of high temperature deformation characteristics are studied through the observation that silicon micro channel plate morphology After high temperature oxidation and analysis of the causes of irregular deformation is under the environment of high temperature and thermal stress caused by finite element simulation software ABAQUS on silicon micro channel array of high temperature deformation are simulated.The simulation results directly response to silicon micro channel array heat stress distribution and pore strain.when the temperature is 1100?,the maximum thermal stress angle reaches 307N/m~2,the maximum thermal stress angle reaches 33.7N/m~2,the inner wall of the center point of stress reaches 50.5N/m~2.Pore outer stress is greater than the interior stress.the channel angle is raised and the wall of the channel is depressed.the simulation results are compared with the experimental results,and we analyzed.the high temperature deformation characteristics of silicon microchannel arrays.Through the high temperature plastic experiment,the silicon microchannel plate is restored to the level.when the temperature reaches 1250 ?,the weight reaches 200 g and the flatness of the high temperature shaping reaches 4hours,the shaping effect is the best.In this paper,The sintering phenomenon of silicon micro channel array is studied,and that the silicon microchannel array sintering phenomenon,and put forward the optimization scheme of silicon microchannel array to reduce sintering phenomena in high temperature in plastic.