A SysML-based Approach To Multi-physics Field Coupled Design And Optimization In MEMS Microstrip Antenna

With the rapid development of national defense, missile-borne antenna as one of the most important aspects of the smart ammunition transformation, its thermal properties and mechanical properties are not only the foundation of the electromagnetic performance implementation, but also the limitation of it. The separation of mechanical design and electrical design often led to long development cycle, high cost and serious problems such as the limited performance. It can be seen that, it has important theoretical significance and broad application prospects to do in-depth research on multidisciplinary design and optimization of a microstrip antenna.This paper comes from the XXXXX project, mainly for an antenna that can be applied to intelligent transformation for conventional ammunition. The miniaturization design of microstrip antenna has been researched and designed. The requirement of vibration and shock under the special working conditions can be met through multi-physical coupling analysis. Main tasks are as follows:(1) Due to the complexity of microstrip antenna design, introduced a system engineering model based on the standard modeling language SysML. It established the system architecture, electrical design, multi-physical field coupling design and optimization model of the microstrip antenna, which built the foundation of the antenna design and simulation. It proves the SysML model driven design method can complete the multidisciplinary design of the microstrip antenna in the system layer, and it provides higher precision and lower cost.(2) It is stated that the composition, characteristics, radiation principle and main electromagnetic properties design parameters of the microstrip antenna, found a suitable miniaturization design method for microstrip antenna under missile loading conditions.Based on it, electrical design has accomplished according to microstrip antenna design principle and electromagnetic simulation technology.(3) Systematic study on the coupling design of the microstrip antenna has been carried out. Especially focused on electromagnetic field analysis, temperature field analysis, thermal deformation analysis and thermal stress analysis. Sequential coupling method and FEA tools are used to explore the situation of electromagnetic field,structure field, temperature field, and the relationships between them. Besides, paper analyzed the reason of the electric performance deviation under multiple physical fields coupling condition, and the solution has been put forward.(4) According to the problem that the electrical performance of high resistivity silicon microstrip antenna can not meet the target in the process of coupled-field analysis. Bandwidth expansion technique has been proposed which use the MEMS technology. In the meantime, the reliability of the antenna has been verified through the simulation analysis under the condition of missile load. Finally, the antenna has been optimized, and the model of missile borne antenna has been built, its muti-physical field performance can all meet the indexes.