Study Of 3D Stacking Assembly Of Circuit Module

As electronic products become increasingly smaller, especially the size and weight of the high-grade equipment, the function for complex circuit of the integrated circuit board becomes more and more small, more and more light, which needs piled on board the number of layers in more and more and correspondings to high degree of accuracy. The original assembly technology already cannot satisfy the requirement of electronic assembly technology, so we need to explore a new kind of process method which not only lightens equipment quality, reduce volume and extend the system battery life, but also improves the ability of the portable equipment, which is called stacked three-dimensional assembly technology.This article introduces a kind of stereoscopic device stack assembly technology, in view of the present circuit module equipments, which are larger in weight and volume and can't meet the demand of equipment miniaturization, high reliability requirements of the bottleneck. Through the use of board-level circuit modules stacked three-dimensional assembly technology, the kind of method improves the level of electronic equipment manufacturing technology, realize the miniaturization of electronic measurement and control lightweight of equipment, modular of equipment, which can meet the needs of the measurement and control equipment development and production of the variable mass.This article summarizes research background, development status and trend of the stacked three-dimensional assembly technology, researches the important significance in market application of stacked three-dimensional assembly technology, analyzes the stacked three-dimensional device packaging problems in circuit design, especially, phenomenon,such as noise, electromagnetic interference, synchronous switch, has carried on the concrete analysis and proposed the solution; the problems of the mutual connection between signal and layer is researched by stack module. The article employs the most advanced vertical interconnect technology to make the stacked three-dimensional assembly device electrical performance good. By controlling the temperature of reflow soldering process, this method decreases the probability of slip, the warping and bridge. The article analyzes the accuracy problems of stacked patch link assembly device and puts forward the corresponding solution in view of the problem; At last, the problems of buckling in theprocess of stacked three-dimensional assembly are analyzed.In this paper, the assembly technique also can be widely used in the electric equipment which has high reliability requirement, the whole machine volume and the weight strictly limited in the production, the method meets the requirements of the future development of high-grade equipment circuit module and keeps electronic equipment in contain more features, the reliability of the electrical connections at the same time, so as to realize miniaturization and lightweight. The technology research results can be extended to other electronic module batch assembly.