Research On Flexible And Stretchable Interconnection Model

With the development of integrated circuit technology, the development trend of integrated circuits has followed Moore's law keep on developing, its integration is increasing, and the feature sizes continue to decrease, while the integrated circuit performance has been improved. With the ever-increasing integration of integrated circuits, the feature sizes continue to decrease, the effect on time delay and power consumption of interconnection line is also increasing. Especially after the feature size of integrated circuits and semiconductor devices goes into the nanometer scale, In high-frequency, some interconnect effects derived from the high frequency has resulted in delay increasing, energy rising and bandwidth narrowing, and these effects are becoming more and more prominent. Some of the relevant characteristics of the interconnection line seems to have become the main factor in the current phase of restricting integrated circuits and semiconductor devices forward performance. Therefore, fast and accurate extraction of high-frequency integrated circuit interconnect parameters(resistance, inductance, capacitance and conductance) has a very important significance for the successful design of high-performance integrated circuits and semiconductor devices.Nowadays in order to meet people's high demands for the portable electronic products, as well as other aspects of shape variability. Malleable flexible electronics technology of semiconductor devices and electronic materials has become the focus of current research and academia. Malleable inorganic flexible integrated electronics refers to the electronic device establishing on a malleable flexible substrate. This malleable flexible electronic devices need some bendable, malleable and other flexible and scalable performance, while maintaining the traditional inorganic electronic devices relatively high performance and high reliability. With the rise of malleable flexible electronics technology, the study of interconnection structure and properties has become a hotspot and difficulty.Considering on the features of malleable inorganic flexible integrated electronics and the malleable flexible interconnect structure, this paper studies some relevant models of the high-speed integrated circuit interconnects, and based on this models, we studied an analysis calculation method for calculating the interconnect parasitic parameters of the malleable flexible interconnect; the establishment of buckling wire interconnect parasitic extractionmethod and lumped RLC resistance inductance and capacitance model. Meanwhile, in order to enable us to verify the correctness of the model, we use the HFSS software to simulate some kinds of interconnect structure, the S-parameters obtained by simulation and calculation were compared.