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Single Wire Full-duplex SWP Interface Circuit Design For Mobile Payment

Posted on:2016-09-18Degree:MasterType:Thesis
Country:ChinaCandidate:K K PengFull Text:PDF
GTID:2348330479453222Subject:Software engineering
Abstract/Summary:PDF Full Text Request
With the maturity and development of mobile payment technology, Near Field Payment(NFC) becoming the major technology way in payment areas because of security, and its easy using.Near Field payments based on near field wireless technology that can be applied into intelligent devices easily. At present, SWP-SIM scenario is more acceptable in china. SWP is the serial interface for data exchange between SIM and CLF.Firstly, Circuit area is valucable resource. SWP use one wire for duplex communication which can reduce the area of circuit. So we need not to modify the area of SIM, and get functional extend for mobile payment.Secondly, SWP interdface is used for high speed smart card. In order to improve the circuit performance in the design of AMBA architechture, I mounted the SWP interface on high throughput AHB bus to improve the read&write rate of SFR. In the design of SWP circuit,I used dedicated DMA channels, In order to ensure fast tranfer. One wire fullduplex feature can also improve the utilization of signals, making communication performace doubled. Communication speed reaches 1Mbps, which has obvious advantages in terms of performance relative to the same type of communication interface in performance test.In additional, SWP interdface is used in the embedded mobile platforms which need high power requirement. I designed low-power state controller for real-time swtich of its working mode. In the system design, we designed clock control module. We used automatic gated clock insertion in the logic synthesis. The circuit power consumption decreased significantly through those ways. Power consumption reaches 1.1mw at normal work mode.Integreted SWP IP in the SOC chip based on arm SC100 core and amba bus. Using SMIC 0.13 process for MPW at the end of May 2014. After the encapsulation of DIE and testing at end of august. Using MP300 for chip test. The test result shows that SOC chip and SWP interface work properly.
Keywords/Search Tags:Mobile Payment, High Performance, Low Power, Single-wire, Full-duplex
PDF Full Text Request
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