Design And Fabrication Of Thermal Analysis Devices For Thin Film Materials

With the miniaturization of electronic devices,thin film materials have been widely used in micro-electromechanical systems?MEMS?,optical and semiconductor devices.Therefore,the study of the thermal properties of thin films is one of the focuses of thin film research.For nanomaterials,the traditional method for bulk analysis is not applicable,and special thermal property analysis devices for nanomaterials need to be designed.According to the two-dimensional characteristics of thin film materials and nanocalorimetry principles,a nanocalorimeter can be designed.The device uses a linear thermal resistance to heat the thin film material,and the electrical signal of the thermal resistance is measured to characterize the thermal property of the thin film material.The innovation of this research is use multiphysics simulation to guide the design and preparation of calorimeter.Through the simulation results,the best device materials and structure is selected,and in the actual preparation process,simple lithography and etching processes can shape the device.It is found that the test error due to thermal radiation of the device is negligible in the simulated temperature range.Through the simulation of different device substrate thickness,substrate material,and thermal resistance shape,the device parameters with the best performance is determined.Then,the accuracy of device testing is verified by the device's simulation of copper film thermal capacity test and indium film melting simulation.For the device preparation,a complete fabrication process include the film growth and patterning has been designed,the entire process can be achieved using microfabrication technology.Among them,the focus is on the optimization of the thin film growth process.The floating membrane and the thermal resistance layer are the two most important parts of the device.The Si O₂ floating membrane is deposited by PECVD,the film quality can be characterized by the film deposition rate and surface roughness.Similarly,by adjusting various parameters of magnetron sputtering,the quality of thermal resistance layer can be characterized by the film deposition rate and surface roughness.For the high-speed measurement requirements of the device,a high-precision and high-speed multimeter is selected to measure the voltage.The data acquisition program has completed.The test system and device together form a complete thin-film thermal physics test platform.Thermodynamic testing of FeCoAlSi thin films and melting point testing of In thin films have verified the feasibility and accuracy of the test of the device.