Film Thermal Parameters Of The Test Structure Design And Simulation

Thermophysical properties of materials typically include coefficient of thermal expansion, thermal conductivity, heat capacity, etc. For the bulk materials, the thermophysical parameters are independent of the Geometry of the materials. But the size of MEMS devices is typically between a few microns to hundreds of microns, with the device structure tends to integration and miniaturization. The thermophysical properties of thin films are dependent on the manufacturing conditions, so it's very important for the MEMS devices to do research on the thermophyscial properties.In this paper, based on the microscale heat transfer theory, we focus on the test method of the thermal expansion coefficient, thermal conductivity and heat capacity of the thin films. This paper discusses the micro-scale thermal analysis theory and its development status, then it studies the test method of the thermal expansion coefficient of thin films, thermal conductivity and heat capacity of the thin films. In this paper, we design the test structures, including the thermal actuator for testing linear thermal expansion coefficient, the Comparative Law for testing thin film thermal conductivity, and the hanging bridge method for testing the heat capacity of thin film. We also simulate these test structures using the software ANSYS. We obtain the best Structural parameters. Then we study the layout design, process steps and measuring steps of the test structures of the thermal conductivity and the heat capacity. Finally, this paper is summarized, and we also outlook the future research.