Study On The Formulation Of Clean-free Over Coat Of UV Curable Nail Gel

Traditional nail polish contains a lot of organic solvents to pollute the environment and harm the human body.UV curing nail oil glue displays excellent performance without VOCs emissions,and has broad market prospects.Nail oil glue can be divided into the bottom glue,the middle layer and the sealing layer glue,and the sealing layer glue covers the high performance requirements.The present sealing layer glues have some disadvantages including large heat release in the curing process,storage instability,odor and coating scrub resistance is not so good.In this paper,the effects of resin,photoinitiator,monomer and nail glue seal formulation on the sealing glue performance and the exothermic properties during the curing process were studied,and the optimum preparation formulation were optimized.(1)The effect of UV photoinitiator on the cured film properties in the LED light were studied.It was found that TPO and 819 could be applied in nail glue seal systems due to they could absorb 400 nm wavelength or more,The best addition mass fraction of the photoinitiator is about 5%.It was also found the ACMO monomer exhibits a very low odor,and has a faster cure rate,the cured film exhibit high hardness,good scratch resistance and solvent wiping resistance.Therefore,the ACMO monomer is an excellent reactive dilution monomer besides exhibits low viscosity.(2)It was found that the smell of resin is generally lower than the monomer,resin curing speed and functionality are closely related,and resin cured film hardness,scratch resistance and solvent resistance wiping performance increases with the increase of the functionality.And also found that resin cured film with a benzene ring structure has excellent solvent resistance and high gloss,but not yellowing.The inhibitor in resins is easy to yellowish under UV light.It was found the performance PRO1500,LED01 and 3414 are better,PRO1500 blended with ACMO has a good storage stability,while 3414 and LED01 storage instability.(3)Due to the steric hindrance of the methyl group,the monomer and the resin with the methyl group usually have a lower curing heat dissipation property than that of the monomers and the resin without methyl groups during the curing process,and the curing rate and heat dissipation property of the resin and the monomer have nothing to do with the functionality but carbon and carbon double bond density,the higher the density of carbon and carbon double bond,the more heat dissipation amount.(4)The sealing layer glue was prepared with PRO1500 as the main resin,ACMO as a diluted monomer,TPO as a initiator,with a small amount of leveling agent,and the properties was compared with KEYSTONE(US product),the results showed that the product has a greater advantage in the curing rate,solvent resistance,scratch resistance and storage stability,and heat dissipation in curing process.Therefore,present product possess good market competitiveness.