Preparation And Properties Of High-performance Thermal Conductive Polyamide 6-based Composites

As electronical products are getting high-power, thinner, lighter and more multi-functional, they pose a strict demand for thermal conductive materials. With such advantages as being light, easy processing and molding, chemical resistance, the polymer thermal conductive composites attract lots of attentions in the field of heat dissipation. In this paper, high-perfermance polyamide 6 thermal conductive composites filled with SiC and AlN were manufactured by means of melting mixing in the extruder, and thermal conductivity, crystallization, mechanical properties, heat resistance of the composites were investigated. In it, epoxy(E51) and coupling agent(KH560) which are the surface active agent were used to modify the fillers. The key to the experiment is to find a effective way to solve the compatibility between polymer and fillers.At the beginning of paper, processing technology how to prepare thermal conductive composites including extruder parameters, injection molding parameters were studied deeply. On this basis, experiment would study on the influence of SiC to the processing, structure and properties of thermal conductive composites. Different percent of SiC, modified and unmodified SiC were added to PA6 respectively to prepare thermal conductive composites and investigated by many kinds of means. The result shows that epoxy resin E51 is a effective modifier for nylon 6 an SiC; The PA6 thermal composite material was made by extruder, the results showed that thermal conductivity of composites reach to 1.1 W/(m·K) when the SiC content is 60wt%. And its flexural modulus enchanced deeply but Izod impact strength went down straightly. Furthermore epoxy resin E51 had good effect on improving properties of composites with the same filler fraction and the E51 weight fraction, which was relative to the weight of PA6,It was 1wt% that can make the properties best. In order to obtain better compatibility between polymer and fillers, epoxy resin E51 and coupling agent(KH560) together were added to the PA6. As the result, it could be found that when the KH560 content was 0.6wt%(for the filler),composites got the better properties obviously.Lastly, In order to obtain high thermal conductivity, AlN was used as the other high thermally conductive fillers with SiC to manufacture PA6 thermal conductive composites. And POE-g-MAH was mixed with composites to enchance its ductility. The research result showed that a few AlN could improve the thermal property of composite material. thermal conductivity of composites reached to 1.2 W/(m·K) when the AlN content was 1wt%, but as the weight of AlN increased, the thermal conductivity of material almost remain unchanged; On the other hand, POE-g-MAH had a little influence on the mechanical properties of composite material.