Ultrasonic Assisted Vibration Grinding Of Single Crystal Silicon

In this work the grinding of single crystal silicon samples was carried out with the assistance of ultrasonic vibrations. The grinding of the samples was achieved using a grinding machine of Harbin Institute of Technology and different grinding wheels. A study was conducted to study the influence different grinding parameters on the grinding force, the surface roughness and the subsurface damages. The influence of the wheel velocity, the feed rate, the depth of cut and finally the use or not of ultrasonic vibrations assistance were determined. The grinding force evolution was investigated using a Kistler dynamometer. The surface roughness was measured using a Taylor Hodson Talysurf profile meter, and the subsurface damages were observed using a scanning electron microscope(SEM). The results show that the increasing of the grinding parameters induced an increasing of the grinding force. Moreover, the benefice of adding ultrasonic vibrations to the system was proved with an average 55% decreasing of the grinding force.An increasing of the surface roughness was observed for an increasing depth of cut and feed rate, although the increasing of the wheel velocity occurred to be beneficial. Adding vibrations seemed benefic, with an average reduction of 34% for the Pv and 45% for the Ra.For the SEM analyzed samples, the addition of ultrasonic vibration proved again to have a positive impact on the subsurface quality with a reduction of the cracks penetration and of their sizes and density. Moreover, the influence of the grinding depth was investigated, and appeared to have a negative impact on the subsurface quality...