The Study Of Composition And Preparation Of Black Hole Solution For PCB

Connections between layers of print plating board(PCB) are achieved through the hole metallizationmethod. However, the traditional hole metallization process mainly depends on the chemical plating technology, and this technology does not meet the requirements of green industrialization. Thus, electrostatic adsorption method is used to handle microporous printed circuit boards in this paper, and this method can provide the conductive properties. Carbon black acts as a conductive medium in this technology, and this conductive medium is dispersed in the aid of surfactant to prepare the black hole solution. Thereby, the surface of substrate is covered by black carbon, which can realize copper plating.This article explored three kinds of surface properties of carbon black, wetting properties and copper sink performance to filter out the best performance of a carbon black as a conductive medium, result showed that M1300 had the best properties. Then, it was found that the effect of transmittance and centrifugal stability were best when the mass ratio of Nonylphenol polyoxyethylene alkylphenol ether phosphate to carbon was 1: 2. After mixing several different surfactants, it got the conclusion that Nonylphenol polyoxyethylene alkylphenol ether phosphate combined with Sodium carboxymethyl cellulose could promote the dispersion of carbon black compared with single surfactant. Several process variables during black carbon dispersion was discussed in our study, and it was discovered that the dispersion and deposition of carbon black was better when p H= 9~11, and the best dispersion time was 2.5h by using a ball crusher.The copper layer had better binding force by using the best black hole technology to dispose the hole wall and surface of PCB. By researching the behavior of copper deposition in acid copper plating solution, it was found that this behavior belonged to diffusion control behavior. Last, this article investigated the Current- time transient curve with different step potential, the growth pattern of copper was affiliated to three-dimensional growth in the early growth stage, Electro-crystallization of copper followed instantaneous nucleation pattern at lower overpotential. To the contrary, e lectro-crystallization of copper deviated instantaneous nucleation pattern at higher overpotential under the effect of surfactants and other additives.