The IGBT Module Integreted Simulation And Optimization Of Micro Channel Heat Sink

IGBT has been widely used in the inverter, power transmission, rail transportation and other fields since its inception in 1982, and it’s one of the fastest growing hybrid power electronic devices now, and was considered the most potential power devices in the power electronics industry, and has been hailed as the CPU of the power electronics industry. IGBT not only has the advantages of fast switching speed and voltage control like MOSFET, but also has the advantages of large current density and low conduction voltage of bipolar transistor. Because IGBT often work for a long time in a state of high frequency switching, and chip integration and current density increasing, a direct result of large power loss due to that most of its transformation into heat resulting in IGBT temperature rising, and semiconductor element is quite sensitive to temperature, high temperature may lead to abnormal function of the chip and burn chip, so the degree of heat dissipation of IGBT module is large extent influence its running safety and service life.This paper will search the new microchannel heat sink technology, namely thermal packaging technology. Design microchannel in the substrate of IGBT module can greatly improve the cooling ability, reduce the radiator design and even omit radiator, so that can reduce energy consumption in the cooling process. Through design simulation of the parallel channel and cross trapezoid channel, put forward a suitable new channel for IGBT thermal packaging, the staggered type trapezoidal micro-channels and increases the heat transfer area to reduce the temperature gradient, make full use of the refrigerant at the entrance to the low thermal resistance and heat flux decreases with the increase of the characteristics of, rational use of material to save energy. Staggered structure helps to increase disturbance, can increase the convective heat transfer coefficient, refrigerant converge in place, and the thermal conduction between internal makes the horizontal temperature gradient decrease, largely compensate for the single row parallel channel’s shortcomings. And through the FLUENT of ANSYS to simulate the flow, solid coupling heat transfer situation, to reflect the heat condition. Then platform to build Pro/Engine modeling and fluent fluid simulation of MDO model in the Isight5.0, through optimization algorithm to find the optimal structure parameters, it’s mainly to obtain parameter of flow passage, the theory and practice show that, micro flow passage for cooling of high power IGBT module has a good application prospect, this paper search for micro flow design, simulation, optimization, and experiment, finally design the staggered micro channel structure, has good thermal performance.