The Cooling Study Of Concavo-convex Microchannel With Multi-source

With the development of multichip module technology in packaging the electronic products, the packaging density become more and more concentrated, also the heat of electronic products continue to improve with the increase of power. MCM products prone to the thermal stress phenomena which caused by uneven heating, Therefore, it is necessary to design the heat sink for MCM products.Comparing with the air cooling, the microchannel mode has the advantage of a small space, compact structure and high efficiency. Also the microchannel package technology is no longer a problem, therefore the microchannel cooling method is an important research field. we can design a different microfluidic channel structure for different heat sources, which make the substrate temperature more uniform.In order to better understand the heat transfer path and study the thermal diffusivity for chip cooling. we simplify the liquid cooling structure, and make the microchannel heat sink equal to a solid heat sink structure, and use backstepping method to analyze the error of the diffusion resistance equivalent formula from Icepack. Finally we conclude that the error rate within 5 % when the pump power is relatively lower.Since that the embossed structure can break the internal fluid boundary layer and make the fluid occur mutual disturbance, which increase the heat transfer. So we analyze the heat transfer characteristics for fine punch and study the dislocation punch, symmetrical concave, double concave dislocation, symmetrical double concave though experimental and numerical analysis. At last we conclude that the concave arc dislocation has a better heat transfer than the other four structures.Finally, we design three kinds of multi-channel microfluidic heat radiator for multi-source, and use Fluent software to analyze the features of heat transfer for the three models, and compare the features of the field of temperature and flow for the three models form the velocity, pump power and the number of layers. We consider the changes in heat source of different region and obtain that the second model has a better heat transfer characteristics and a lower pump power.