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Hybrid Integrated Packaging Of Array Laser And A Novel Laser Based On ADM

Posted on:2017-05-22Degree:MasterType:Thesis
Country:ChinaCandidate:Y J QianFull Text:PDF
GTID:2308330485468288Subject:Materials engineering
Abstract/Summary:PDF Full Text Request
With the rapidly growth of mobile communications broadband access, fixed broadband access and other communications services, the requirements of data center and network access’s transmission speed and capacity are becoming increasingly high. To improve the bandwidth and achieve higher transmission speed, dense wavelength division multiplexing (DWDM) is proposed as one of the feasible schemes, in which system semiconductor laser is usually used as a core source. How to get a laser array with low cost and excellent performance is a very important topic, so we focus on the laser array module’s packaging process and performance analysis in this paper. In addition, studying on a new type of laser light source and achieving special function will also explore more applications of semiconductor lasers. This is why we also focus on the novel laser structures based on add drop multiplexing (ADM). Its basic simulation analysis and optimization work are achieved in this paper.The basically introduction of semiconductor laser’s principles, its classifications, the hybrid integrated package of laser array, difficulties in microwave packaging, reconstruction-equivalent-chirp (REC) technology and photonic integrated circuits (PIC) technology are all introduced. We emphasize the great advantages of REC technology:low cost, mass production, high wavelength accuracy. Moreover, it’s compatible with the traditional lithography technology. It can be said that REC technology is an ideal chip manufacturing technology, which provides a great convenience for the development of PICThe research work of this paper is mainly separated into two parts. In the first part, the packaging process and module performance of 16 channel array laser based on REC technology is studied, including the design of the package structure, the assembly process and the performance test of the 16 channel tunable laser module. Finally, the first array laser module with a tuning rate of 16× 2.5 Gb/s is realized, and the parameters such as wavelength spacing and uniformity, side mode suppression ratio and modulation rate of this module all meet the requirements of DWDM system. The second part designs and simulates the performance of the lasers with double outputs (0 order and 1 order mode) based on the ADM structure, including the basic grating structure and parameter design, performance simulation analysis and structure optimization.
Keywords/Search Tags:Dense wavelength division multiplexing, Array laser, Hybrid integrated package, Add drop multiplexer
PDF Full Text Request
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