The Optimization And Improvement Of Coating And Developing Process

With the continuous development of science and technology, in the high-speed information age, digital products, electronic equipment, automation equipment has been into every aspect of our surroundings, directly affects the quality of our life. The semiconductor device, which is the basis for its application is more and more widely, reached unprecedented development. In general, for the consumer, on the one hand,what they need is smaller and smaller semiconductor devices, on the other hand, they also want to improve the running speed of the device. For semiconductor device producers, on the one hand, need to increase the area of the wafer, on the other hand, need to narrow line width of bare chip; it not only can meet the demand of the consumers, but also reduce the cost of each of the bare chip. Abroad, due to the semiconductor industry started early, and well-funded, most have been classified as 12 inch chip production, and domestic general is given priority to with 6 and 8 inches production line.But for the people who engaged in the semiconductor manufacturing industry, the only way to improve the user experience is reducing the line width of semiconductor devices(CD, Critical Dimension).It is easy to determine the destination, but it is difficult to achieve the goal. First, we need to optimize process flow to bring the smaller CD. I worked in the yellow area which is the key link to decide the size of CD in the whole process, there are many factors affecting the change of the CD, contains the sensitivity of the photoresist, soft bake temperature and time, the wavelength of exposure light, exposure energy, focal length, post exposure bake temperature and time, developing and so on will affect the CD. Among them, the development is a very important step, any hardware parameters in developing module would affect the change of the CD, this article is based on LD Nozzle(a Nozzle type), according to the variation of CD as the judgment standard, sum up the optimization parameters to make CD achieve a state by experiment, then the process become stable and yield(Yield) become improved.Second, due to the shrinking CD, the defect generated in semiconductor process, including coating, exposure, development, baking process impact the yield more and more. Because the narrowing of the CD, the module(Die) on the same area will become more, then the same size of the defect will affect more modules. So, the requirement of reducing, preventing and eliminating the defect becomes more and more important. I will research and distinguish the type and causes in this article. I also use some experimental methods to find ways to reduce the defect occurred, such as the use of the machine, both inside and outside environment of maintenance, process the program settings, the adjustment of the equipment Hardware(Hardware) and so on, and study how to prevent the defect occurred as far as possible.