A New Mask Of Haze Defect Detection Method Research

Lithography technology is the core of semiconductor manufacturing technology, and mask lithography as a mold in Lithography technology, so the mask defects has been a very important defects. We can through the existing traditional mask defect detection method can detect, but haze defect because of its small size formation reasons and defects in itself, is not easy to be detected. But the haze defect as a mask of common defects, and will often appear on the mask and products. In recent ars, with narrow line width, the product of haze defect tolerance is becoming more and more low. This requires that the semiconductor manufacturing plants to timely and accurately find the haze defects, the traditional mode of haze defect detection is dependent on light cover scanning equipment, but this way of scanning equipment demand is big, and the equipment cost is high, the scanning accuracy while high sweep efficiency is low.This thesis is mainly from the haze defect detection methods of research, based on the company’s existing equipment and software conditions, makes the way of low cost and high efficiency to detect haze defects. the focus of the thesis is to found a new method of haze defect detection. The method is based on the traditional mask printing-down to optimize the detection, the traditional way of mask printing-down is generally applied to the detection mask defect and general defect of the product. The new detection method is based on reduction product exposure energy to enhance haze defects on the wafer, and at the same time through optimizing scanning recipes the purpose is for haze defect scan achieve a good result. Finally through software stack processing, so haze defect can be found defective. This new detection method for testing equipment and production requirements is low, but it also be able to timely and accurately detect the haze defect, so widely used in the company.