The Study And Fabrication Of LTCC Substrate Technology Based On Crystal Oscillator

In response to the rapid development of wireless communications, the miniaturization and high reliability of electronic products have become more and more important. Packaging of electronic technology become an indispensable important component in the field of electronics industry. According to the requirements for electronic packaging substrate: low temperature co-fired, good dielectric properties, be similar to chip in thermal expansion coefficient, good mechanical properties, high thermal performance, etc. The project selected the material composition based on suitable literature of LTCC materials.We are focusing on the process and implementation to obtain a final sample. We have analyzed samples with scanning electron microscope, an impedance analyzer, thermal expansion coefficient tester and so do the results of the analysis and interpretation of the theory.During tape casting process, to study the effects of various organic additives(dispersing agent, a binder and a plasticizer, etc.)on the slurry, in order to obtain good green tape. Finally the composition of slurry is determined, slurry viscosity is 1300 MPa·s. To study halftone screen printing qualities and parameters and the printing operations’ effects on the horizontal electrodes, the electrode paste viscosity is 26, printed twice. Drying process for students with students with properties of very large, through the study of the mechanism of the drying process, and found that under existing conditions(slurry has been determined), even if improved drying process, the implementation of both sides of the dry thickness of green tape is also no more than 0.4cm, otherwise there will be born with a crack and can not become a substrate. Later that good performance can change by changing the microstructure.LTCC materials and silver co-firing is a key to achieving the overall size of the sample, through process improvements to achieve co-firing. Which controlled shrinkage for co-firing matching heterogeneous materials plays an important role. Through we have study the mechanism of contraction, adjustment heterogeneous material shrinkage and densification temperature, the oxide is added to the slurry to reduce the temperature and density of a certain difference in the processing of silver paste to achieve the reduction, the cofired matchment can be better achieved.The final baking the sample has a low sintering temperature(900°C) dielectric constant of 6.5, the temperature coefficient of resonant frequencies is-2.5ppm/°C, flexural strength 160 MPa, poor analysis since the substrate is too thin, the overall mechanical damage performance.Overall process improvement and process parameters can be adjusted in order to obtain performance microscopic composition better substrates.