The Research Of Subsequent Repair Method For 65nm Advanced Node OPC

In the semiconductor manufacturing process, lithography technology is one of the most critical technologies of integrated circuits, which is an important economical impact factors throughout the product manufacturing. The cost of lithography occupies 30 to 35 percentage of that of overall the manufacturing loop. Lithography technology is also the important reason why integrated circuits developed following the Moore raw. While the line width of the lithography process is becoming smaller and smaller, the line width and uniformity of lithography has more and more impact on industrial manufacturing.On the coming age of ’sub-micron’lithography, the optical proximity correction (OPC) technology is widely used in the semiconductor industry. From the rule-based OPC in 0.18 micron to model-based OPC in 0.13 micron, until the recently released 32/28nm CPU from Intel, OPC technology is almost applied to every chips in advanced nodes. With the more complexity of the device and OPC models in the advanced nodes, the OPC jobs runtime increases drastically with more CPUS used for one job. The design house is always under the pressure of cycle time in the modern world, so that it push up the capability of foundry to the limit. It requires the foundry to control the cycle time of every step. So, naturally the OPC runtime in the foundry must be under control. And because the varieties of layout pattern from design house are almost infinite, it’s impossible to work out a perfect script for all of them. Then the post OPC patterns in some designs will certainly have some weak points, which will cause defects in every wafer. The cost of re-running the OPC job is so higher because of tighter schedule and long run time that we have figure out some workaround. In this dissertation, we summarize and compare most of popular resolution enhancement techniques and optical proximity correction approaches. We focus on several post OPC repairing approaches and have the following results::1. Manual OPC, which is fast and able to be controlled accurately. The disadvantage is that if there are too many weak points, the cost will be higher.2. Rule-based post-OPC, which is fast and can be applied to full chip. Currently it is widely used in production in all foundries..