Key Technique & Failure Analysis In Telecommunication PCB Material

This article’s anlysis bases on the key technology of current communication PCB, do comparation between high frequency, high speed signal and high reliability PCB material, focus on its performance index. We proposed improvement methods through optimization experiments, get improvement on performance and reliability.We do huge number of analysis on failure mode, researches have been conducted on the delamination and CAF, which provides suggestion for improvement, data are obtained from daily work. The design specification is provided according to the high speed, frequency and reliability requirement. Here shares my experiences with all PCB related workers.