Research On Key Technology Of Full Wafer Nanoimprint Lithography

The full wafer nanoimprint lithography is a class of large area nanoimprint patterning method,has been widely used in Light emitting diode,wafer level optical device and solar cell panels.In the face of LED nano-patterned problems,researching on the full wafer level nanoimprint lithography is very important.But at present the full wafer level nanoimprint in the key technology of demolding and template production problems, which need to be solved urgently.This project conducts the preliminary research on the two core issues of demolding and templates.Due to the traditional demolding mode,demold force is larger, this paper adopts to peel demolding mode.Firstly,theoretical analysis of the demolding process involves the interaction of the solid-solid interface in the demolding process, there is adhesion force.Therefore, applying contact mechanics theory analyzes several contact theory and the theoretical models.In addition the demolding process will due to defects of the mold, therefore,the application of fracture mechanics to the stress and strain is analyzed in the demolding process, which lays the theoretical foundation for the numerical simulation of demolding process.When followed by numerical simulation of the demolding process,this paper adopts to geometric model of peel demolding.Numerical simulation is carried out with ABAQUS finite element software to the peel demolding separately on different displacement load, aspect ratio, graphics layer cycle length, material and angle and comes to certain conclusions.Traditional mold structure can not meet the needs of large-scale manufacture of LED nano-patterned,in this paper mold is improved,a new method of the full wafer level nanoimprint lithography which based on complex soft mold is put forward.Therefore,in this paper two sets of template copying device are designed, and describes how it works, and two sets of devices are able to independently complete the production of complex soft mold.