Thermal Management And Package Design Of RoF Link Transceiver Module For Space Application

Radio over Fiber (RoF) communication technology combines the adventages of optical communication technology (wide bandwidth, low loss, anti-electromagnetic interference and light weight) and microwave communication technology (high flexibility, wide coverage and movable). It has been widely used in the fields of satellite communication, national defense industry and civilian communication. And, more and more researchers began to pay attention to this technology.For the systems applied to space, the vacuum environment, there are two major issues in the process of system integration. One is the thermal dissipation issue, bacause it is more difficult to achieve since there is no convection in a vacuum environment. The other is the miniaturization issue bacause of the narrow volume, numerous payloads and concentrated components of satelite.In this paper, based on this two considerarions, thermal dissipation models of the high-power devices in RoF transceiver module, for example lasers and amplifier, in the process of RoF’s miniaturization is analyzed by using ANSYS, a finite element analysis software. On this basis, effective thermal management solutions have been proposed and used, such as adding heatsinks with big thermal conductivity coefficient. Result shows that the system can work within an appropriate temperature range in a long term by using this cooling solution.In addition, packaging solutions for RoF transceiver module has been desiged in this paper by using Solidworks software, based on the analysis of thermal control, anti-radiation, electromagnetic compatibility and some other issues. Eventually, the RoF transceiver module has been packed with a high level of integration, thereby achieve a compact package design.