The Design And Application Of A Kind Of Process Capability Testing PCB With Any Layer Ultra-thin Structure

As the global smart mobile terminals (smart mobile phones, portable tablet PC) motherboard component carrier PCB (Print Circuit Board) is rapidly developed toward the direction of multi-gender, high-density wiring, high-speed, high-frequency, ultra-thin, the traditional home and abroad PCB manufacturers’existing processes, equipment cannot meet these requirements, as well as the PCB manufacturing technology can doubt that the entire terminal equipment market have become increasingly prominent in synchronized mass production. This thesis studies the design and application of the arbitrary thin layer interconnection process capability test board PCB, and the main work is as follows:Firstly, this thesis introduces the basic concepts of PCB, analyzes several common arbitrarily increasing density interconnect layer technology, including arbitrary layer interconnect hole technology, embedded bump interconnect technology, any overlapping holes interconnect technology and new column bump interconnect technology, then analyzes some of the PCB testing techniques, such as shadow texture ripple testing, impedance measurement techniques, the concepts and testing of faulty measurement methods.Secondly, according to the actual needs of any thin layer PCB interconnection capacity test, this thesis presents the overall framework of the structural design, and determination of the specific type of constitution, also presents the module design, and layer stacked structure related to the design, including sizing control modules between measurement, impedance measurement module, process capability alignment layer test modules, laser micro alignment module integrated alignment module, BGA test modules over the line capacity and CAF ability test modules, and presents the detailed design of the corresponding module.Finally, the test plate samples is tested related to the design module, the test results show that the indicators of the test panels meet the design requirements and the PCB has been used in real work.This thesis presents a PCB, based on the latest manufacturing technology, the mobile communications industry that reflects the current process capability intelligent terminal for high-end PCB testing requirements slim PCB. And on the PCB, which is equipped with several modules used to determine the ability of the PCB manufacturing process, but also through a PCB manufacturing company designed and manufactured by the PCB,testing results of the analysis of data to confirm the level of an enterprise level process capability.