Detection And Analysis Of Flux Dynamic Spreading Process In Groove And Flip-chip Dipping Process

Flip chip technology is a kind of integrated circuit packaging method, and it has been widely applied in high performance, high density packaging. Flux coating is an important process in flip chip packages. The flux-coating quality will directly affect the quality and reliability of chip packaging. Therefore, it is very important to choose an appropriate flux coating technology for the development of flip chip bonding equipment. A gluing method for flux dipping was put forward in the paper, and the flux dynamic spreading process was detected and analyzed by an optical method. The main research works of this paper are as follows:(1) Put forward a gluing method for flux dipping. In this flux coating method, flux was transferred from a container to the flux groove by a gluing way, and the flip chip was immerged into the flux at a certain depth by suction nozzle, so that a suitable amount of flux was coated on the flip chip solder ball.(2) Designed an optical method to realize the detection of flux dynamic spreading process in the groove. Built a flux dynamic spreading process detecting experimental platform system; designed the mechanical structure of the detection system, selected and processed the accessories, and Realized the software programming of movement control system and image acquisition system based on Labview.(3) Machine vision system was built to record the flux flow process after gluing, and the image data was processed based on Maltlab. The influence rule of flux spreading process influenced by flux viscosity and gluing speed was analyzed.(4) The flip-chip bumps flux dipping process was record by high speed camera system. The effects on dipping results influenced by flux viscosity, dipping acceleration, dipping depth and standing time were analyzed, and it provides an effective reference in choosing appropriate flux coating technological parameters.