Modeling Study And Research On Electromagnetic Interference If Through Silicon Via

With the demand of the electronic products getting greater, the microelectronic packaging becomes small, high-speed, high-density and systematized. At the same time, The through silicon via technology plays a more important role in the integrated circuit products. In the engineering application, the electronic device may be disturbed or have circuit logic fault when the operating frequency is getting higher. To avoid the fault happening, it is necessary to build the circuit model to analyze the effects at the preliminary stage of the circuit design, which is more important for the systems with high complexity and high-level integration.Taking the classic TSV packaging structure as an example, the equivalent model of the TSV packaging is built to study the effect of the electromagnetic interference. Firstly, the parasitic parameters are extracted based on the single TSV packaging structure. Then results of the simulation of equivalent circuit of the double TSV packaging is compared to the actual measurement results, which verifies the correctness and effectiveness of the equivalent model and provides the possibility of getting the other parameters of the TSV circuit model by simulation. Secondly, the analytical formula of the equivalent source of the electromagnetic interference is presented by transforming the plane-wave form the conductive form with the electromagnetic coupling theory. The equivalent source is loaded into the circuit with the ADS software to build the equivalent circuit for electromagnetic susceptibility testing. Last, the electromagnetic susceptibility model of a CMOS transmission gate with the TSV packaging is built, and the simulation results show that the circuit with the TSV packaging structure can decrease the effect of the electromagnetic interference.With the help of the field circuit coupling method we can easily get the equivalent model of the TSV packaging which helps designers to test the performance of the TSV packaging circuit more quickly. Package play an important role in protecting circuits mechanical and has resistance to electromagnetic interference, TSV for has a very significant inhibition on electromagnetic interference.