Pulsation Flow And Heat Transfer In Wavy Microchannels

The chip contains more and more electronic components and gets more powerful performance with the development of electronic science and technology, thus its power consumption increases, it will generate a lot of heat. Traditional natural convection or forced air cooling heat transfer sometimes has problems of restriction of space condition, and high noise when it’s old, and without adequate cooling capacity. Consequently, the issue of thermal failure has become more and more important to reduce its performance and life. It seriously hinders the application and development of the electronic science and technology in daily life.For air cooling, the microchannel liquid cooling has more compact structure, lower noise, higher cooling capacity and requires less space. Meanwhile, the modern process technology has been able to solve the problem that the liquid-cooled way may have a liquid leakage. In order to meet the demand of cooling the high heat flux of electronic chips, the study of fluid flow and heat transfer in the microchannel has been an important research direction of getting an uniform heat transfer and less power consumption for the electronic chip with high heat flux.In order to enhance heat transfer, the main way is through breaking the fluid boundary layer and strengthening the fluid mixing. At present the common method is through increasing the flow velocity, as a result,it is ineffective and high energy consumption. For these reasons, this paper numerically studied the heat and mass transfer in wavy wall microchannel subjected to pulsation flow, as a comparation, the straight wall microchannel and steady flow had been also studied. The main research parameters are wavelength, amplitude and frequency, etc.Finally, based on the principle of bionics, through studying the transport system of the animals, plants and nature, the fractal-like microchannel heat sink with good heat and mass transfer performance and high temperature uniformity was designed, and a 3-D numerical simulation was conducted to stduy it. Then, this model was manufactured by mechanical processing, we had also set up a experimental patform and a liquid cooling system for CPU to experimentally study its heat and mass transfer performance. Meanwhile we also experimentally studied the heat and mass transfer performance of the copper powder nanofluid in this heat sink.The results proved that the wavy wall microchannel with pulsation flow has a very good heat and mass transfer performane. Fractal microchannel heat sink has excellent cooling performance and temperature uniformity. Copper powder nanofluid has stronger convective heat transfer ability than water. Compared with air cooling, the CPU liquid cooling system could keep the CPU in a good range of working temperature, and significantly increases its usability, at the same time, the noise is very small..At last, a liquid cooling system for CPU of the computer was designed, the heat sink is used in the cooling system, and the temperature of the CPU is much lower than air cooling.