Numerical Analysis And Optimization Of Flow And Heat Transfer Characteristics Of Microchannel Heat Sinks With Non-uniform Heat Sources

With the continuous development of microelectronic technology,the manufacturing process has advanced by leaps and bounds,and the chip performance has been significantly improved.The heat flux in the chip is also increasing,and the heat flux is up to 1000W/cm~2.Traditional air forced convection cooling can not meet the demand of heat dissipation,micro-channel heat sink has strong heat transfer ability,compact structure and other advantages are widely studied and used.At the same time,the heat flux in the core area of the chip is often several times that of the background area.The traditional microchannel heat sink will cause high temperature in the hot spot area and excessive cooling in the background area under the condition of hot spot and heat source,and the temperature distribution of the heat source surface is uneven.How to ensure that the heat sink can effectively cool the chip hot spot under low power consumption becomes an urgent problem to be solved in chip thermal management.In this paper,based on single-layer microchannel heat sink and manifold microchannel heat sink,the microchannel heat sink is designed for single/multi-hot heat source conditions respectively.The flow and heat transfer characteristics in the microchannel heat sink were analyzed by numerical analysis method,and the parameters of the microchannel structure were optimized by the optimization method based on the proxy model.A hybrid micro-channel heat sink(IM-HM)with pin fin micro-channel at the middle inlet was proposed and compared with the traditional rectangular micro-channel(RM)by numerical analysis.The results show that,IM-HM significantly reduces the maximum temperature in the hot spot area and improves the temperature uniformity of the heat source surface.The IM-HM was improved by observing the flow characteristics in the channel.The improved IM-HM only needs 1.6%power consumption to achieve the same heat dissipation capacity of RM.A hotspot targeted cooling manifold microchannel heat sink(HT-MMCHS)was proposed for multi-hot spot heat source conditions.The numerical analysis method is used to compare the traditional manifold micro-channel heat sink,manifold pin fin heat sink and manifold pin fin-micro-channel hybrid heat sink.An HT-MMCHS-2 manifold microchannel heat sink with similar structure is proposed to observe the flow heat transfer characteristics of HT-MMCHS.Compared with the traditional microchannel heat sink,the maximum temperature and temperature difference decreased by 38.5%and 58.4%.The surrogate model is used to predict the temperature distribution,pressure loss,maximum temperature,and temperature difference of the micro-channel heat sink under various heat sources and structural parameters,with a good prediction effect obtained.Under various heat source conditions,the optimization algorithm was used to fine tune the structure parameters of the microchannel heat sink.A graphical user interface was developed to shorten the construction time of the surrogate model and to display the predicted results.