The Research On Shock Resistance Of Circuit Board And Typical Devices In Different Fuze Potting Structure

Electronic equipment protected can use potting process, it can prevent the internalelectronic system threatened by external environment. So the electronic Fuze internalelectronic system available work must be after potting. The research of Fuze potting materialselection, electronic circuit working state and the typical circuit devices within the maximumimpact load, always only experience no data in our country.At the first, this paper introduces two potting materials commonly used in electric Fuze,Epoxy and polyurethane, as well as introduces their characteristics and physical properties. Atthe second, design circuit boards with horizontal, inclined and vertical three postures intopotting materials, potting structures with aluminum shell. Design entity mode with grid byTrueGrid software. The potting structure with initial velocity impact to the rigid body,simulate the high speed collision process of Fuze penetration in the target, dynamic responseanalysis of the circuit board in potting structure by LS-DYNA software. Then, get impactstress distribution characteristics of circuit boards with different postures in two kinds ofpotting material by LS-PREPOST post-processing software. At the third, according to thestress simulation conclusion, the circuit board welding multiple crystals with different attitudeto impact test after potting process. Crystals working state on the circuit board in high impactcan validate the results of software simulation, because of the crystals is the most sensitiveelement for acceleration. In this paper, the working state of the potting crystals is dynamicallymonitored by the impact testing machine and the HS5virtual oscilloscope. The wave form ofthe potting crystals with different poses changing from stable work to damage in the conditionof acceleration is observed.This paper puts forward some help Suggestions for improvement to impact resistance ofpotting device, through analysis the dynamic response of the circuit board within differentpotting structures, and the impact test. It provides the experimental data for the typical circuit devices can effective work in the maximum impact load.