Analyse And Simulation Of Vibration Isolation Of The Flip-chip Bonding Machine

With the development of semiconductor manufacturing process, line width hasdeveloped from the previous90nm to the present22nm, and the requirements forsemiconductor manufacturing equipment are also getting higher and higher. IC(integrated circuit) flip chip welding machine (hereinafter referred to as flip chipwelding machine), as one of the most important process equipment for chip scalepackaging, tiny vibration may lead to its unclear focus. The micro vibrationenvironment interference of the design of isolation system is complicated. There arenot only shocks from the ground, but also interference of the equipment movement.Therefore, the precision isolation system is supposed to isolate vibrations of highfrequency interference effectively, as well as the low frequency and super lowfrequency interference.Based on the prototype of flip chip welding machine, the essay focuses on itssystem structure and vibration isolation in order to improve its performance and theeffect of vibration isolation. According to the theories of mechanical vibration andisolation, and ANSYS software characteristics, it analyzes the vibration state of theoptical center of flip chip welding machine by using ANSYS Workbench, reproducingthe vibration state of flip chip welding machine under different frequency excitation,which provides a basis for the improvement of transmission efficiency and stability, aswell as a reference for the model establishment. Through the application of simulationsoftware to the flip chip welding machine, it provides a research plan to improve thevibration isolation effect and reduce the experimental cost and time. Meanwhile, wehave accumulated experiences in the structure of flip chip welding machine andcomponent selection.The main research contents are as follows:First, based on the structure and working principle of the flip chip weldingmachine, it reveals the main forms and reasons of alignment failure caused byvibration.Second, to establish the geometric model of the flip chip welding machine using3D software Solid Works, and to establish the finite element model of flip chipwelding machine on the basis of ANSYS Workbench.Third, it makes research on the effect of different excitation frequency on the flipchip welding machine optical center, and makes analysis of the effect of rubberisolation pad. Finally, it screens out the feasibility of vibration isolation design scheme bysimulation analysis of different excitation and parameters based on the ANSYSWorkbench software. The test shows that the results of finite element simulation hasplayed a guiding role effectively in the flip chip welding machine design, and hasengineering application value in the improvement of working accuracy of flip chipwelding machine.