Research On The Thermal Performance Of High-power LED Lights

High-power LED lamps have a larger heat flux. High temperatures will adversely affect the LEDchip. Therefore, this paper mainly from lower LED chip junction temperature starting, aspects ofcomposition structure, thermal resistance on the path and junction temperature calculation, it is brieflydiscussed. And test the numerical calculation method under natural convection rationality andreliability of the results. On the "parallel fins radiator" of bottom opening for a detailed study. Andanalyze the case of the radiator heat five different power case11kinds of width. Found bottomopening can effectively reduce the maximum temperature value. And there is an optimal widthresulting in the lowest temperature, which is not changed with the loading power. Optimization of theentire lamp cooling structure adopted after the first part of the whole idea. First studies on singleradiator, two improved program design: first, flip the PCB board installed in order to reduce theeffects of PCB board thermal resistance, thereby reducing the total thermal resistance of the entirecooling path, improved the structure of the overall cooling capacity. Second, using the research resultsobtained the above to slit on the bottom of the radiator. And three different fin height of two slit widthwere studied. Finally, integrated the above two structural optimization, and used this new structure tosimulate the whole lights to find a more excellent heat dissipation structure. Finally, the integration ofthese two optimized structure, and use this new structure to simulate, to find a more excellent heatdissipation structure.