The Technical Design Tile Edger Ultrasonic Vibration System And Practical Application

Ceramic tile edge grinding and chamfering is an important part of the processing of ceramics. He was a direct impact on the ceramic four sides and four angles of the processing quality. With industrial development of ceramic tile grinding method and equipment has made long-term progress,but the combination of the existing tile edging and chamfering production line is, there are still high energy consμmption, low efficiency, poor quality of edge grinding, grinding wheel loss fast and other key issues to be resolved. The existing processing methods can be divided into dry grinding and wet grinding, while the wet grinding process is complex and high cost. And dry grinding principle of the use of motor driven wheel rotation grinding of ceramic tiles, the technology is mature and stable, but there are also some problems, such as low efficiency, large abrasion, high energy consμmption, and it is easy to cause hard and brittle workpiece edge collapse, collapse angle and serrated edge defects. In the research group, a new technology of ceramic tile grinding is proposed, which is applied to the ceramic tile grinding process creatively. Through this process can reduce the grinding force, grinding the grinding heat, improve the surface roughness and grinding of ceramic tile can reduce the edge collapse. This paper focuses on the research of the vibration system and ultrasonic milling process of the ceramic tile grinding machine:First according to the theory of one-dimensional longitudinal vibration swapping can design theory, horn and tool head, then modal of ultrasonic vibrator is analyzed using finite element analysis software COMSOL multiphysics.Second oscillator design and manufacturing, and sμmmarize the assembly process, and explore the temperature, pre tightening force, the load on the resonant frequency, anti resonance frequency, dynamic resistance, the influence law of the quality factor, finally with the laser Doppler vibrometer testing assembly completed the oscillator amplitude to theoretical design requirements.Finally, the author studies the in the process of ultrasonic grinding ceramic tile, feed rate, feed rate, spindle speed and power of ultrasonic factors on the effect of the surface roughness. Then the orthogonal experiment research the factors of pressure density effect on the size of the extent of. The influence of various process parameters on the surface roughness is in turn as follows:spindle speed> Cutting amount> feed rate> ultrasonic power. The most suitable ultrasonic grinding process conditions are as follows:the spindle speed is 1988r/min, the feed rate is 0.3mm, the feed rate is 15mm/s, the ultrasonic voltage is 100v.