Cutting Force Alloy Thin Film Sensor Technology

As an important monitoring signal,the cutting force directly reflects the state of cuttingtool in the cutting process.It is of great significance for improving cutting methods and cuttingquality that obtain the cutting force signals accurately.The modern machining is to develop inthe direction of high-rate cutting and ultra-precision.Traditional cutting dynamometer isdifficult to adapt to the dynamic environment of modern machining.Researching anddesigning cutting force measuring system is an important subject in recent years,which isreal-time,highly accurate and efficient.The thin film sensor technology becomes more mature in recent years,and it has beenwidely applied in various domains.It also provide a new breakthrough for the development ofstrain gage type cutting dynamometer.Based on the previous researches,this paper firstexplored the fundamentals of strain sensor.A new type of alloy thin film sensor is designedthat can be readily measure the cutting force.We Designed the material and size of sensorunit,and constructed a cutting force measurement system.Theoretical analysis is performed forthe sensor unit,and the formula for output of the measurement system is concluded.A microcantilever sensor model was used to study piezoresistive properties of the alloyfilms.We discusses the feasibility that analyze the piezoresistive properties of alloy films byANSYS12.0software. We also analyzed the influence of the location and the film thickness ofthe thin-film layer on the sensor output.Contrasting the piezoresistive properties of constantanthin-film and nickel-chromium thin-film,we found the nickel-chromium thin-film had a highsensitivity. The simplified model of the cutting force measurement system was founded.Theoutput characteristic of the sensor unit was simulated and analysed,and it indicated thecorrectness of the output voltage formulas. The formulae of cutting forces have been obtainedin this paper.The key processing technologies for the sensor unit were studied. According to currenttechnology and conditions,we designed the technological processes for preparing the sensor unit.The principle of dual-ion beam sputtering and ion-beam etching is studied.The preliminary experimental study were performed,that created the foundation for the follow-upstudy.