Experimental Study On Thermal Contact Resistance Between Solid-solid Surfaces And Development On Database Query System

With the development of the microchip integration, cooling of electronic device has been key factor to influence the working performance of the whole microchips. Therein, thermal contact resistance (TCR) has been key parameter to influence the cooling of whole electronic device. Nowadays, thermal contact resistance is widely used in applications of machinery, electrical cooling, aerospace, micro-physics and etc.In this paper, steady state testing method is adopted to measure the thermal contact resistance of the several metal materials, including aluminum alloy materials of5A05H112,3A21,3A21H112,6063,6061H112and tungsten-copper alloy materials of30W3, which are matched and analyzed under different contacting conditions. Based on the testing data, the task is mainly developed to research the influence of the several main parameters to the contacting heat resistance of solid-solid surfaces, including interface press, surface roughness, material properties, direction and value of heat flow. Through comparison, lower interface press deemed to be the most important factor to influence thermal contact resistance, has a more apparent influence to the thermal contact resistance.Database query system of my own regarding on solid-solid surface TCR is established to achieve the inquiry of the testing data and analysis of pictures. The established system is powerful and friendly owing convenient accesses to maintain the data and to connect to every module. Besides, it is also able to cover analysis and research tasks on processing test data and to improve the capability in data analysis, providing enough reference data and scientific guidance for real engineering application and scientific research.