HDI PCB Fine Line Of Etch Uniformity Basedon Genesis Software

At present,the practical application of the HDI board line specification arebasically stuck in between75μm~100μm, but when the BGA pitch is further reduced,HDI circuit board will need to be more precise direction, line with and distance from75μm/75μm line developed to50μm/50μm lines, and even to the30μm/30μm fine line.It will require a higher for error control on the production process.The purpose of using the HDI designs is to improve the circuit board wiringdensity, but reducing the size of PCB. The surface copper uniformity of PCB substratehas a large impact on the quality of products. Abroad, Israel Orbotech Valor, a jointventure with Frontline company use computer-aided manufacturing systems (CAM)software, and put forward a series of solution, but because of China’s PCB enterprise’sactual situation is different and difficult to promote and application. This paper studiesthe use of Genesis software researches HDI board fine line production technology. Afterengineering design, system regulates the fine craftsmanship of each line controlparameters and obtained PCB enterprises in line with the actual situation of the fine linefabrication error control scheme. Genesis2000software can be modified procedure ofdifferent copper area and automatically modify etching factor to achieve better results.The actual production results applied in the enterprise and have obtained bettereconomic effects.This paper uses Genesis software to design the fold structure of fine line andcompensate the etching. Using the Minitab software to identity blind holes filled copperparameters. The best combination of parameters is current density is1.5ASD, pulsetime is80ms/6ms, Cu2+density of65g/l, brightener’s concentration is10ml/l. Fine linesetched etch uniformity parameters is that temperature of55℃, etching up pressure is3kg/cm2, under pressure is2.4kg/cm2and the etching rate is2m/min. Aftercompensation for fine line design, the use of optimal experimental parameters toproduce the fine line, results show that it is good quality and did not find any defect inquality, in accordance with IPC quality requirements. Looking HDI future direction ofdevelopment and technical capabilities at home and abroad, to improve the fine linesetch uniformity, once this technology stability, it will greatly enhance our competitivestrength HDI PCB. Subsequent research should focus on improving product performance stability, so to ease application the new technological processes andpromote. It also enhances the fine line of HDI PCB production efficiency.