50μm/50μm PCB Development Based On Genesis

With the enormously development of IC industry and the continuous launch ofvarious components, as well as the multi-functionalization of components have madethe pin counts in per unit area increase substantially, thus PCB technology has to makecorresponding obvious change. With the increasing density of components assembly oncircuit boards, PCB products are developing towards ultra-thin, small components, highdensity, and so on, this made fine circuit technique in PCB manufacturing moreimportant; the subject of this article is50μm/50μm circuit boards through the design ofGenesis2000software while combining customer’s requirement on performance andquality of fine circuit boards, the research has made breakthrough on50μm/50μmcircuit boards manufacturing difficulties and improved50μm/50μm circuit boards’production yield, and has met products quality specification, and reached the level ofmass production. The main researched and breached difficulties including:I. find proper ways to make breakthrough on layer to layer registration, surfacecopper evenness, circuit evenness, dielectric evenness, open/short defect on inner/outerlayer, as well as standardizing factory’s manufacture.1. For layer to layer registration, design the trial boards’ manufacturing processthrough Genesis software, find the best registration design system by trial running eachprocess’s registration system, in order to achieve better registration.2. For surface copper evenness, first identify the best surface copper platingequipment through experiments, then set the best plating parameters through the designof experiments.3. For circuit evenness, design the trial boards’ inner/outer layer image throughGenesis software, make the design of experiments on the etching factors and find thebest parameters of etching temperature, speed, pressure, ways of spraying and loadingboards, to maximize the etching factor.4. For evenness of the dielectric hickness, calculate the copper residue rate anddesign the pressing stack through Genesis software, then make experiments to find thebest pressing parameters (pressure and heating rate) and the dielectric type, to get themost evenness dielectric that can best satisfy customer’s requirement.5. For AOI, design AOI inspection data through Genesis, then adjust parameters through experiments to find the best match between inspection parameters and designeddata.II. Products that are on trial stage have passed solderability, thermal stress, thermalshock, and other reliability tests.III. Achieved the industrialization of50μm/50μm PCB, those products’ quality hasreached international standard level also, which has provided important instruction andtechnology reserve to the achievement of mass production and future research for50μm/50μm PCB.