Risk Management Of The New Substrate Import Project For Integrated Circuit Manufacturing

Integrated circuit industry has been continuing developing along the route of Moore’s law. New materials are developed especially the substrate as the footstone of IC to meet the customer’s requirements such as the chip function, size, power consumption and so on. Integrated circuit manufacturing enterprises import new substrates to improve the performance of the product, yield and cost, but the import process is full of risks which may cause low yield and production interruption.With the development of IC industry, GaAs, sapphire and other new materials are used. Some unfamiliar but important parameters will be omitted inevitably in traditional evaluation process. Cost and project schedule will be unacceptable if the new material is evaluated overall. The traditional evaluation method and process are no longer suitable for new material. This thesis will study the risk management of new substrate import project in integrated circuit manufacturing industry and will take silicon substrate import project for example. The author tries to establish a feasible new substrate evaluation process and method in order to save cost shorten duration and avoid risk.This thesis takes the evaluation of silicon substrate in CMOS (Complementary Metal Oxide Semiconductor) production line for example and use risk management methods and tools to identify and analyze pivotal risk factors in order to establish feasible process and method for new substrate import project.